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High-precision dynamic tracking platform combined with responsive motion control modules for fast, accurate, and efficient laser modification of glass

Custom-engineered optical path system tailored for multi-material compatibility and stable, repeatable process performance

Multiple vision alignment modes adaptable to fiducial marks, external contours, and other positioning strategies

Proprietary control software developed by DR Laser with bilingual (Chinese/English) interface for enhanced user experience

Excellent material compatibility supports quartz, borosilicate, soda-lime, aluminosilicate, and other specialty glass types

Flexible patterning capabilities enable fabrication of round holes, square holes, blind vias, through vias, and micro-grooves as required

Outstanding deep-hole processing with aspect ratio up to 1:100, minimum hole diameter ≤ 5 μm

Good hole quality with smooth inner-side walls that are free of cracks and burs

High throughput and capacity optimized for large-scale production

Precise positioning and repeatability for micro-level accuracy

Activation depth ≥ 7 μm

Throughput > 25 wafers per hour @ 8-inch

Excellent sheet resistance uniformity and surface appearance

Full-process in-situ monitoring and feedback capability

Supports ultra-thin wafers, TAIKO wafers, and warped wafers

Equipped with laser-assisted heating system

Supports wafer sizes of wide range and thicknesses

Suitable for various substrates including sapphire, silicon, silicon carbide, lithium tantalate, and more

High positioning accuracy and repeatability

Excellent cutting quality with high straightness, no chipping or cracks

Minimal damage zone