Product laser
Products
Large-format high-precision gantry platform, capable of processing glass substrates up to 1600 × 1000 mm
Multi-stage substrate leveling mechanisms including floating clamps and glass hooks
Adaptive dust extraction system with synchronized airflow outlets for superior cleanliness during processing
High-speed processing with scribing speeds >1.5 m/s and 8–12 laser channels operating in parallel
Excellent process compatibility: customizable optics and processing schemes based on specific cell structures
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Specification |
Details |
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Equipment Dimensions (L×W×H) |
2800 mm × 3000 mm × 2350 mm |
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Effective Processing Area |
1650 mm × 1000 mm (tolerance ±1.0 mm) |
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Laser Wavelength |
355 to 1064 nm |
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XY-Axis Positioning Accuracy |
≤±5μm |
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Cycle Time |
40s |
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Positioning System |
Mechanical Alignment + Vision-Based Alignment |
