Product laser
Products
Selective, High-Precision Laser Soldering
Fully Automated Handling
Integrated Vision Alignment System
Contact Force Feedback and Parallelism Control
Flexible Process Customization
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Specification |
Details |
|
Soldering Method |
Selective Contact Laser Soldering |
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Laser Energy Control |
Programmable pulse energy for selective and uniform transfer |
|
Process Area (Laser Soldering) |
≤ 100 x 100 mm |
|
Carrier Size Support |
≤ 200 x 200 mm |
|
Substrate Size Support |
Support up to G2.5 |
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Vision System |
Integrated Coaxial Alignment + Large FOV Pre-Alignment |
|
Alignment Accuracy * |
±0.2 μm @ 3 σ |
|
Contact Force Monitoring |
Configurable with ±0.1% linearity and real-time force feedback |
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Parallelism Control Tolerance |
±5 μm across bonding surface |
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Automation Features |
Full auto-loading/unloading, fiducial recognition, alignment sequencing |
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Production Scalability |
Supports R&D, NPI, and mass production lines |
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*Carrier to substrate alignment, by high contrast chrome mask pattern |
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